Samsung Electronics is reportedly making swift moves to recruit top talent leaving Intel amid ongoing restructuring. Sources including Chosun Biz, The Wall Street Journal, and The Korea Herald suggest that seasoned Intel engineers specializing in advanced packaging, glass substrates, and backside power delivery networks (BSPDN) are prime targets for Samsung and its affiliate, Samsung Electro-Mechanics.

Veteran engineers are the key to Samsung’s strategy. One notable hire is Gang Duan, a former senior Intel packaging engineer, now leading technology marketing and application engineering at Samsung Electro-Mechanics’ U.S. subsidiary. Duan’s work with innovative glass materials has been pivotal in Intel’s packaging advancements, making his move to Samsung unusual and signaling the seriousness of the talent outflow.

The talent migration follows Intel’s internal shake-up. CEO Lip-Bu Tan recently announced a workforce reduction of about 15%, equating to over 25,000 positions, alongside project cancellations and operational streamlining. These changes have left many engineers seeking new opportunities, creating a recruiting goldmine for competitors like Samsung.

Samsung’s expansion in the U.S. foundry and R&D staffing underscores urgency. Reports indicate that the company is actively hiring engineers with expertise in packaging technologies where Samsung’s experience is currently limited. The first half of 2025 already saw a senior Intel engineer specializing in Embedded Multi-Die Interconnect Bridge (EMIB) technology join Samsung’s foundry division.

Glass substrate production is a central focus. Samsung Electro-Mechanics plans mass production of glass substrates by 2027, with pilot lines already operating at its Sejong facility. This move positions Samsung to compete more aggressively in advanced semiconductor manufacturing, particularly in areas that Intel previously dominated.

Industry observers note the broader implications. As Intel scales back investments and cancels fab projects, other tech giants are likely to benefit from the availability of experienced engineers. Samsung’s recruitment of top-tier talent may accelerate its technological edge, particularly in the U.S. market, and reshape competitive dynamics in the semiconductor sector.

For more details, read the full report here: TrendForce News

This article reflects early signs of how corporate restructuring can ripple across the global semiconductor landscape, with human stories of career shifts at its heart.