Micron, a leading innovator in memory technology, has unveiled a groundbreaking achievement in memory performance with the introduction of the world’s fastest HBM3 Gen2 memory, boasting an impressive 1.2 TB/s speed. This remarkable advancement comes alongside the revelation that Micron is preparing to embark on mass production of 32GB DDR5 chips, with plans to expand into even higher capacity modules by the first half of 2024.

Micron’s prowess in memory technology is underscored by its use of the cutting-edge 1β (1-beta) process for manufacturing the monolithic 32GB DDR5 memory circuit. This process represents the latest in advanced manufacturing techniques, avoiding the use of extreme ultraviolet lithography.

While Micron is tight-lipped about the specific data rates of the new 32GB DDR5 chips, the unveiling of these chips marks a significant milestone. These chips open the door to the potential creation of 1TB DDR5 modules, a prospect that holds immense promise for future memory solutions.

Notably, Micron has chosen a measured approach in rolling out high-capacity memory solutions. While the new 32GB chips hint at the possibility of 1TB modules, Micron’s strategy involves initially offering 128GB modules in the coming year. This reflects the company’s commitment to striking a balance between pushing the boundaries of innovation and ensuring the practicality and efficiency of its products.

The announcement of HBM3 Gen2 memory is aptly named due to its remarkable total bandwidth of 1.2TB/s through an 8-level stack, with a current maximum capacity of 24GB (with 36GB circuits on the horizon). This latest generation demonstrates a significant leap in energy efficiency, boasting an increase of 2.5 times over its predecessor, HBM2E.

Micron’s forward-looking roadmap goes beyond these impressive advancements. The company’s plans include the development of HBMNex memory, potentially referred to as HBM4. Expected to debut in 2026, HBMNex is projected to provide an astonishing 2+ TB/s bandwidth, coupled with the potential for up to 64GB in capacity.

Micron’s unveiling of the world’s fastest HBM3 Gen2 memory and its preparations for the production of 32GB DDR5 chips highlight the company’s unwavering commitment to pushing the boundaries of memory technology. As the industry evolves and demands for faster, more efficient, and higher-capacity memory solutions continue to grow, Micron remains at the forefront of innovation, shaping the landscape of memory technology for years to come.